Qualcomm grabbed the 3D Sensing market and entered mass production at the end of the year. In addition to being able to be widely used in Android smartphones next year, it is expected to expand into the drone and vehicle industry for a long time.
In addition, Qualcomm ultrasonic fingerprint recognition technology, to catch up with the current market mainstream full-screen panel design, terminal products are expected to come out at the end of this year or early next year.
Apple iPhone 8 will introduce 3D sensing technology to support new face recognition, attracting international companies to rush into research and development. According to industry news, Apple's 3D sensor cooperated with major manufacturers such as STMicroelectronics, and was commissioned by TSMC and the investment and packaging factory to produce the finished materials. The third quarter has been mass-produced.
Zhang Jianzhong, vice president of Qualcomm Engineering, said that the 3D sensing technology developed by Qualcomm is mainly used in face recognition. It mainly uses structured light technology to apply non-infrared light (IR) to objects and then through the lens. The reflected light is received, the depth of the object is recognized, and the object is rendered in 3D by an algorithm developed by Qualcomm.
Zhang Jianzhong pointed out that Qualcomm is quite optimistic about the application of 3D sensor camera in face recognition. Because there are quite a lot of face features, although fingerprint recognition is quite practical, if 10 fingers need to take a lot of time to fully sense, the face only needs Once identified, it saves a lot of time. In the future, it can even be used in security, automotive, robotics or virtual reality (VR) applications.
Even the future can be integrated into the glassesZhang Jianzhong specifically pointed out that the 3D sensor camera can even be integrated into the glasses in the future. When the user enters the dark room, the invisible light can be quickly scanned, and then the scanned image is projected onto the glasses, even in the black environment. It can be moved safely.
It is understood that Qualcomm will cooperate with Qijing, TSMC, and fine materials in 3D sensing technology to enter mass production at the end of the year. Among them, Wonderland is responsible for optical components and algorithms. TSMC is a wafer foundry for sensors and chips. TSMC's materials are responsible for wafer-level packaging and testing.
Ultrasonic fingerprint recognition will also be introducedAs for the fingerprint identification product part, Qualcomm introduced an ultrasonic recognition solution. Zhang Jianzhong said that the advantage of ultrasonic fingerprint recognition is that the fingerprint can be completely recognized regardless of whether the finger is stained with water drops or emulsion. The safety is better than the capacitive solution. The most important thing is that it can be integrated under the panel glass, just in line with the current smart phone. Designed towards a full screen.
Qualcomm's ultrasonic fingerprint identification program has been sent to mainland smartphone brands such as Huawei, OPPO, Vivo, etc. Vivo has even confirmed that it will adopt Qualcomm solutions, and the terminal products are expected to be available at the end of the year or in the first half of next year.
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