The International Semiconductor Equipment Materials Industry Association (SEMI) predicts that the scale of the world's fab front-end process equipment spending will grow by 133% in 2009 compared to 2009, and in 2011 it will again achieve an 18% growth rate. The world's established fab capacity, including discrete component plants, is estimated to grow by 7% in 2010 and will grow by 8% in 2011.
The WorldFabForecast report and expects that the global fab construction spending will grow by 125% in 2010 and will grow by 22% in 2011. According to SEMI's data, there will be more than 150 fab construction plans in 2010 and 2011, with a total estimated expenditure of US$83 billion; this estimate is based on each fab construction plan and equipment expenditure plan. Covers large/small capacity fabs, as well as fabs producing microelectromechanical systems (MEMS), LEDs, and discrete components.
The report pointed out that in 2010 a total of 54 fab construction plans are underway, construction spending totaled about 4.5 billion US dollars; in these plans, 50% are LED fabs, and most of them are located in China. Although the fab construction plan to be implemented in 2011 is small, the scale is relatively large, and the construction expenditure totals about US$5.5 billion.
SEMI estimates that global semiconductor equipment spending will grow by 133% in 2010 to reach $34 billion; in 2008, global semiconductor equipment spending grew by 27%. The association also predicts that global semiconductor equipment spending will grow by another 18% in 2011, reaching a scale of $39 billion, exceeding the 2007 level.
As for the number of fabs operating in 2010, there are about 22 fabs, of which more than 50% are LED factories. In addition, next year, 28 fabs are expected to open, including four memory plants. By the end of 2010, the company has established wafer production capacity (excluding discrete components), which is estimated to reach 14.4 million 8-inch wafers per month. In 2010, the number is expected to grow by 8% to 1,580 per month. Wan 8 inch is about the wafer.
SEMI pointed out that the memory factory is the largest in the world to build wafer capacity, accounting for 41% in 2010 and 2011; the wafer foundry is second, the proportion will be 24% in 2009, In 2011, it grew to around 26%.
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