At present, the sensors in smart homes are basically integrated sensors. The integrated sensors are small-sized sensors that are cost-effective and easy to use by integrating semiconductor sensitive components and measurement processing circuits on one chip using integrated circuit technology.
By using integrated circuit technology and micromachining methods, electromechanical sensitive components and processing circuits based on various physical effects can be integrated on one chip to form a Micro-Electro-Mechanical Systems (MEMS) sensor.
The sensor-sensitive structure can be up to micron and sub-micron in size, and can be mass-produced, and has the advantages of small size, light weight, fast response, high sensitivity, and low cost.
China's MEMS industry is in a leading position in the world, including the sensors invented by our Chinese on the trains of the United States on Mars. Like MEMS accelerometers and pressure sensors have been widely used in the automotive industry, like all-in-one in smart homes. Detection sensors are typical applications for MEMS.
MEMS is not only based on electronic processes, but also on machining technology.
The development of new technologies and processes such as integrated circuit technology and micromachining technology has made it possible to integrate and miniaturize sensors. Sensitive components fabricated using micromachining technology are typically micron-sized, using anisotropic etching, sacrificial layering, and LIGA processes (ie, photolithography, electroforming, and injection molding) to create a large layer-to-layer relationship. Differential three-dimensional microstructures, including movable diaphragms, cantilever beams, bridges, and grooves, voids, cones, and the like.
The single-chip integration technology using sensitive structure and detection circuit can avoid the parasitic effect introduced by pin leads during multi-chip assembly, improve the performance of the device and improve the anti-interference ability. The micro-sensors manufactured by microelectronics and micromachining technology adopt system-level packaging method, which has smaller volume, lighter weight, lower cost, lower power consumption, high reliability and is suitable for mass production compared with traditional sensors. Easy to integrate and intelligent, it has become part of the decision system in smart homes.
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