As a pro-son of Google, Huawei has spent a lot of effort on building the Nexus 6P, and Google seems to be very satisfied, so they will continue to cooperate.
Now, some foreign media have found that Huawei has secretly registered the registered trademark of “Huawei 7Pâ€, and this has also triggered curiosity. It is known that there has been news that Huawei may continue to OEM Nexus mobile phones because they want to It is up to it to open the US market.
There have been rumors that HTC has to become a new OEM partner for Nexus mobile phones, but in the face of Huawei's competition, Google may continue its previous dual-player strategy, one is high-end, one is mid-range, and the high-end is highly likely. It is Huawei.
For the current Huawei, they are more and more determined on the middle and high-end roads. Of course, the sales volume continues to grow. In particular, the recently launched dual-camera P9, which was completed in cooperation with Leica, has made their confidence burst.
A group of sales results released by Huawei (as of March 31, 2016): Mate 8 has sold more than 3 million units; P8 has sold more than 5 million units; Mate 7 has sold more than 7 million units.
The copper base board is the most expensive one among the metal substrates, and the heat conduction effect is many times better than that of the aluminum substrate and the iron substrate. It is suitable for high-frequency circuits and regions with high and low temperature variations and the heat dissipation and architectural decoration industries of precision communication equipment.
Generally, the finishing include ENIG, immersion silver, LF HASL, OSP, etc. The copper substrate circuit layer is required to have a large current carrying capacity, so a thick copper foil should be used, and the thickness is generally 35 μm to 280 μm; the thermal conductive insulating layer is the core technology of the copper substrate, and the core thermal conductive component is aluminum oxide and silicon powder. It consists of a polymer filled with epoxy resin, low thermal resistance (0.15), excellent viscoelasticity, resistance to heat aging, and ability to withstand mechanical and thermal stresses.
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