[Brand Power·Hongli Optoelectronics] Flip-chip discrete devices are the future trend

“Currently, there are many advantages in flip-chip packaging. There are four main features: 1. Solder-free wire, better reliability; 2. Low thermal resistance; 3. Ultra-high current drive; 4. Different solid crystal technology can be used, for example Eutectic process, silver glue process, solder paste process, etc.. Wang Gaiyang, director of Hongli Optoelectronics , mentioned in the Shanghai station tour on April 28th .


Wang Gaiyang, Director of Hongli Optoelectronics Products


Hongli Optoelectronics is a key high-tech enterprise in the National Torch Program, which is dedicated to the research and production of high-end LEDs. The company has domestic leading white LED packaging technology and high-power LED packaging technology. In 2012 and 2013, China's lighting white LED packaging company ranked first in competitiveness, and in 2014 China's COB packaging output value first (GLII).

This year, Hongli Optoelectronics launched a new high-density LED array that provides more possibilities for LED lighting in high-lumen, high-density applications.


Hongli Photoelectric booth


“Flip-chip device is more consistent due to the white-light wafer process and phosphor molding technology. The MacAdam ellipse is controlled by a third-order ellipse with high white light concentration. It is made of high thermal conductivity and has a thermal resistance of about 6°C. /W, can reduce Tj; solder paste eutectic thermal conductivity of 57W / m · k, ceramic substrate heat dissipation." Wang Gaoyang said that based on the above advantages, it can be flexibly applied to mobile phone flash, TV backlight, lighting and other applications.

In addition, in the development trend of the AC module, Wang Gaoyang also said that it has three major advantages: "First, the cost, the same power conversion efficiency, the same power factor, the AC product is reduced by more than 5% than the DC product cost. Assembly hours Reduce and reduce labor costs; Second, electrical parameters: η>85% PF>0.95 THD<20%, the overall lighting efficiency is 95lm/W, Ra=80; Third, assembly, direct mains drive, convenient for customer assembly , to reduce the volume of the lamp body, the third generation of integrated die products, the volume of the lamp body is reduced by more than 10%."

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