匡通电子SMD LED packaging process has reached the international advanced level

On July 9th, the “New Chip (SMD) LED Packaging Process” of Hubei Zigui Yutong Electronics Co., Ltd. was recognized as reaching the international advanced level, and the “injection molding process” reached the international leading level.

The illumination angle is expanded from 120 degrees to 150 degrees, the light extraction efficiency is increased by 20%, the packaging cost is reduced by more than 50%, and the product life is extended by more than 30%, which fills the blank of the SMD LED applied to the outdoor high-definition electronic display.

The company's first integrated circuit packaging process, that is, injecting packaged chip LEDs, is a major technological innovation in SMD LED packaging. The process can be widely applied to the fields of illumination, backlight, flexible lamp strip, electronic display screen, etc., and fills the blank of the patch LED applied to the external high-definition electronic display screen, and has high commercial value.

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