Secco quickly expands overseas Ethernet switching chip market

Suzhou, September 7, 2011 / PRNewswire Asia /-Recently, Shengke Networks (Suzhou) Co., Ltd. (hereinafter referred to as "Shengke") successfully signed SouthBridge in the United States as another overseas agent of Shengke. Prior to this, she has signed contracts with mainland China agents Shenzhen Cyberlink and Wuhan Lantu Technology. In March this year, she signed Israel EMY-tech as an agent in the Middle East and then successively signed ELREPCO and Broadband Technology AB as agents in Northern California and Northern Europe. This indicates that Shengke's Ethernet switching chip series with independent intellectual property rights in China and Solutions based on core chips are gradually going to overseas markets. At the same time, such a rapid expansion speed also shows that Shengke's products have been recognized by the international market and achieved preliminary results.

SouthBridge was established in 1994 and is one of the largest agents in the electronics manufacturing sector in the Southeastern United States. Successful agents include NET LOGIC, TDK, DDC, XILINX, TOSHIBA, VICOR. Andy Thompson, director of SouthBrigde, said, "SouthBridge is very pleased to introduce Secco's products into the United States. Secco's products and business models are exactly what we need, and the products are also welcomed by our customers. We hope to cooperate with Secco To help it succeed in the North American market. "

In the first half of this year, Shengke launched two Ethernet switching core chips CTC6028 (ManhattanTM) and CTC5048 (BrooklynTM), which together with the existing CTC6048 (HumberTM) packet switching core chip and CTC8032 (RichmondTM) switching network core chip to build a complete TransWarp TM, the Ethernet switching chip product series. This product series provides a comprehensive, competitive and differentiated chip solution for network equipment providers to build network equipment from fixed-configuration box systems to modular distributed architectures. In July, the industry-leading hardware-based MPLS-TP OAM solution was launched, enabling telecom equipment manufacturers, especially transmission equipment manufacturers, to flexibly deploy MPLS-TP-based transmission equipment and interwork with the IP / MPLS core network to ensure bearer Smooth upgrade of the network to the packet transport network (PTN).

Sun Jianyong, general manager of Centec, said, "Ethernet has now become the foundation of the communications industry, and the core chip is one of the key factors that determine the cost performance and competitiveness of the product. Centec's high-end technology and flexible business model can help customers improve Differentiate competitiveness, reduce R & D investment, and shorten product launch time. At present, we have established sales systems in Asia, Israel, Northern Europe, the United States, and Canada, and we will further expand this system in the future. I believe that with partners for local communications and Familiarity with the telecommunications market will certainly bring our products and solutions to more regions. At the same time, we will provide customers and partners with comprehensive and in-depth information from products, technologies, brand publicity, training, expansion, and services. stand by."

About Shengke

Since its establishment, Shengke has been committed to becoming a collaborator and provider of core chip-level customized network solutions. Shengke has successfully developed and launched a dual-stack 10 Gigabit core switching chip CTC6024, a high-expansion backplane switching network chip CTC8032 and a second-generation Ethernet routing switching core chip CTC6048 based on CTC6024, which can be built from fixed configuration to full distribution. Multiple system forms of the architecture. Based on the CTC6024 / CTC6048 / CTC8032 chip series, Shengke independently developed a complete bottom-up system switching platform. Shengke provides customers with flexible cooperation methods. Customers can choose a variety of cooperation modes based on chips, boards, systems, licenses, etc. according to different needs.

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