What are the highlights of the artificial intelligence software platform in 2018? At this year's "China (Shanghai) International Artificial Intelligence Exhibition" hosted by OFweek China's high-tech industry portal and high-tech association, you will be given the answer.
In 2017, the artificial intelligence industry's achievements in algorithms and software platforms are also dazzling. Globally, Google TensorFlow is still the most in-depth deep learning framework, far surpassing others. On this basis, the latest version of TensorFlow Lite and TensorFlow 1.5 have been launched, and Amazon is still new.
What are the highlights of the artificial intelligence software platform in 2018? The answer will be given to you at the China (Shanghai) International Artificial Intelligence Exhibition hosted by OFweek China High-Tech Industry Portal and High-Tech Association.
GoogleLast May, at the Google I/O Developers Conference, Google announced a new version of TensorFlow specifically for mobile device optimization systems. In November, TensorFlow Lite was officially released. Since then, TensorFlow 1.5 has been introduced.
TensorFlow is a deep learning tool that runs on mobile devices, allowing developers to run artificial intelligence applications on their mobile devices in real time. Since the official release of TensorFlow Lite, there have been several learning software libraries installed on mobile devices with similar functions, including Apple's CoreML, Clarifai artificial intelligence cloud training service, and the Kirin 970 artificial intelligence processor used by Huawei Mate10.
This year, what new trees will Google have on the artificial intelligence software platform?
AmazonAt the Amazon AWS re:Invent 2017 conference last November, the company released 22 new products, including computing power, database, machine learning, intelligent hardware and IOT, especially in terms of computing power and database. Upgraded.
Among them, AWS Cloud launched a new product EKS, which is a Kubernete container service hosted on AWS cloud. It is not only compatible with cloudy environment, but also has the advantages of high availability, automatic deployment, independent upgrade, and integration with other services on AWS. Seamless integration, applications in ECS can also use other AWS services.
What about Amazon's 2018? Wait and see.
FacebookIn early 2017, Facebook released a new machine learning toolkit, PyTorch, for the Python language based on the machine learning and scientific computing tool Torch. At the end of last year, this toolkit ushered in its 0.3.0 version, which added multiple function functions and improved performance in many aspects.
It’s not as good as Google and Amazon, and it’s unclear whether Facebook’s negative news-related Facebook may have more plans for artificial intelligence software this year. After all, Zuckerberg announced that his personal challenge this year was to fix Facebook.
Will 2018's Facebook launch new AI software?
BaiduAt the Baidu World Congress last year, DuerOS, which is the next generation of human-computer interaction, ushered in a major upgrade and launched version 2.0. According to official sources, DuerOS 2.0 mainly brings two changes: one is the upgrade of the small smart device open platform; the other is the new release of the small skill open platform. So far, based on voice interaction, DuerOS has formed two open platforms for docking device developers, eco partners, and online and offline service providers.
With the DuerOS 2.0, Raven Raven H sets a new benchmark in functionality and user experience. In 2018, what new developments will Baidu have in the field of artificial intelligence?
TencentIn November last year, Tencent Cloud officially released SUPERMIND intelligent network products. According to reports, compared to the previous network products, SUPERMIND intelligent network will have three characteristics of high performance, global interconnection, and intelligence.
It is understood that the use of artificial intelligence to achieve the entire process of network planning, construction and operation and maintenance is the biggest highlight of Tencent Cloud SUPERMIND network products. Tencent Cloud SUPERMIND intelligent network can combine tens of thousands of line feature intelligent planning, through historical usage analysis, network path analysis, user feedback analysis, node planning suggestions, special line expansion suggestions, etc., reasonably plan the network construction route, greatly shorten the planning time, Save time costs.
In the new year, what software platform applications will Tencent launch?
Focusing on deep learning, hardware chips, software platforms, visual and voice technologies, and terminal applications, the OFweek 2018 China (Shanghai) International Artificial Intelligence is sponsored by OFweek China High-Tech Industry Portal and the High-Tech Association. The exhibition will be held on August 30-September 1st, 2018 at the Shanghai International Sourcing Exhibition Center.
In addition to the software platform exhibition area, the exhibition will also showcase seven major industry applications including chip/hardware, terminal applications, smart cars, intelligent (service) robots, intelligent identification, and smart medical products. The products cover artificial intelligence upstream software and midstream applications. Technology, as well as terminal products, the entire industry chain integration layout.
Antenk D-Sub,D-Shaped Connectors Solutions offer a broad range of higher reliability D-Sub connectors.
Antenk's D-Sub product line is designed for applications that require a rugged, robust I/O connector system with various styles and mounting options. All are used in a variety of industries including computer, industrial, medical, and military markets.
Antenk High-Density D-Sub Connectors
Available in cable mount options including crimp & solder cup and the board mount options including Dip Solder, Wire Wrap, High Profile, Right Angle, & Surface Mount (SMT). This comprehensive Antenk High-Density Density D-Sub product offering is available in both stamped & formed and machined contact options.
High density D-Sub connectors, for applications where the best possible contact density is required. Due to the [high" density of the 15, 26, 44, 62 and 78 contacts, this series is ideal for the most modern applications. The insulating body, a monoblock, complies with the UL94 V-0 standard. The contacts are machined and available in several quality classes.
Antenk Solder Type D-Sub Connector
Available in standard and high density versions
Supplied with stamped & formed or screw machine contacts.
Standard contact terminations accomodate up to 20 AWG standard wire
Available with white (nylon) or black (PBT) insulators. Standard shell plating is tin
Antenk D-Sub connectors solder cup machined contacts are manufactured according to the standards MIL-C-24308 and DIN 41652. The standard connectors from Antenk are available in all known versions and sizes. They are available in various version with numerous assemblies. The insulating body, a monoblock, complies with the UL94 V-0 standard. The contacts are machined and available in several quality classes.
Features of Antenk's Solder Cup Standard D-Sub Connector Machined contacts
Solder cup d-sub available in 5 industry sizes/positions
Standard Density (9 pin, 15 pin, 25 pin, 37 pin, 50 pin)
Tin shells have indents to provide grounding and additional retention.
Screw machine contacts offer high reliability. Non-removable contacts.
Optional mounting hardware available.
Materials of Antenk Solder Cup Standard D-Sub Connector Machined contacts
Shell: Steel, tin plated
Insulator: Glass-filled thermoplastic. U.L. rated 94V-O
(260°C process temp)
Machined contacts:
Male pins - Brass | Female pins - Brass
Plating: Gold flash on entire contact
Contact us for other plating options
Features of Solder Cup High Density D-Sub Machined Contacts
Solder cup d-subs in 4 industry sizes/positions
High Density (15 pin, 26 pin, 44 pin, 62 pin).
Approximately 65% more higher density then standard d-sub connectors.
Screw machined contacts offer high reliability.
Metal Shell provides EMI/RFI shielding. Available in 3 clinch-nut options.
Plug shells have indents to provide grounding & additional retention.
Connectors will fit in standard D-sub backshells.
Contacts will accept (28 - 24) gauge wire.
Materials of Solder Cup High Density D-Sub Machined Contacts
Shell: Steel, Nickel plated
Insulator: Glass-filled, PBT Thermoplastic. U.L. rated 94V-O
(230°C process temp)
Machined contacts: Brass, Gold Flash Plated(contact us for other plating options)
9 pin, 15 pin, 25 pin, 37 pin, 50 pin Male Solder Cup Standard D-Sub Connectors Machined Contacts, Solder Cup High Density D-Sub Machined Contacts,Female Solder Cup Standard D-Sub Connectors Machined Contacts
ShenZhen Antenk Electronics Co,Ltd , https://www.atkconnectors.com