MEMS is a micro-electro-mechanical system (Micro-Electro-Mechanical SySTems) refers to a micro-device or system that can be produced in batches, integrating micro-mechanisms, micro-sensors, micro-actuators, and signal processing and control circuits until interfaces, communications and power are equal to one. . MEMS is developed with the development of semiconductor integrated circuit micro-processing technology and ultra-precision machining technology. At present, MEMS processing technology is also widely used in fields such as microfluidic chips and synthetic biology, so as to conduct biochemistry and other laboratories. Chip integration of technical processes.
MEMS mainly includes micro-mechanisms, micro-sensors, micro-actuators and corresponding processing circuits. It is a high-tech frontier subject developed on the basis of fusion of a variety of micro-processing technologies and the application of the latest achievements of modern information technology.
It is a high-tech frontier discipline developed on the basis of fusing a variety of micro-processing technologies and applying the latest achievements of modern information technology. The development of MEMS technology has opened up a new technical field and industry. Micro sensors, micro actuators, micro components, micro mechanical optical devices, vacuum microelectronic devices, power electronic devices, etc., made with MEMS technology are used in aviation, aerospace, automotive, There are very broad application prospects in biomedicine, environmental monitoring, military and almost all fields that people come into contact with. MEMS technology is developing into a huge industry. At present, the leading products in the MEMS market are pressure sensors, accelerometers, micro gyroscopes, ink nozzles and hard disk drive heads.
MEMS is a new research and development field that must consider the mixed effects of multiple physical fields at the same time. Compared with traditional machinery, their size is smaller, the largest is no more than one centimeter, or even just a few microns, and their thickness is even smaller . Using silicon-based materials and using generation technology similar to integrated circuits (IC), mature technologies and processes in IC production can be used in large quantities for mass and low-cost production, making the cost-effectiveness relative to traditional "mechanical" manufacturing technology substantial improvement.
A complete MEMS is an integrated micro device system composed of micro sensors, micro actuators, signal processing and control circuits, communication interfaces and power supplies. Its goal is to integrate the acquisition, processing and execution of information to form a multi-functional micro-system and integrate it into a large-scale system, thereby greatly improving the automation, intelligence and reliability of the system.
The packaging form of MEMS devices is a key factor in bringing MEMS-based system solutions to the market. The study found that in today's typical MEMS-based products, packaging costs account for almost 20% to 40% of all material and assembly costs. Due to the influence of production factors, the cost of testing after packaging is higher than the cost of testing at the device level, which makes the packaging selection and design of MEMS products more important.
The MEMS device design team must consider and pay great attention to the packaging strategy and how to compromise before starting each design and throughout the entire design process. Many MEMS product suppliers will regard product packaging as the main product difference and competitive advantage for market competition.
Designing the packaging of MEMS devices is often more complicated than designing the packaging of ordinary integrated circuits. This is because engineers often have to follow some additional design constraints and meet the requirements of working in harsh environmental conditions. The device should be able to be clearly distinguished from the measured medium in such a harsh environment. These media may be as gentle as dry air, or as harsh as blood, radiator radiation, etc.
First of all, the packaging of MEMS devices must be able to interact with the environment. The packaging of MEMS devices must also meet other mechanical and heat dissipation margin requirements. As the output of a MEMS device, it may be a mechanical motor or pressure change. Therefore, the mechanical parasitics of the package may interact and interfere with the function of the device. When different materials are mixed in the package, their expansion and contraction coefficients are different. Therefore, the stress caused by these changes is added to the pressure value of the sensor. In optical MEMS devices, packaging stress caused by shock, vibration, or thermal expansion can shift the alignment between the optical device and the optical fiber. In high-precision accelerometers and gyroscopes, the package needs to be isolated from the MEMS chip to optimize performance.
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