The new mobile phone antenna puts new demands on the antenna technology and also promotes new technologies. A new idea is to directly put all the antennas on the outer casing of the mobile phone. For example, the HTC M8 and the legendary iPhone6 ​​have the antenna on the metal casing, and the antenna and the casing are integrally formed directly. To this end, some new technologies have been applied to antenna production, such as LDS, LRP, 3D printing, etc. are being used. Today we will introduce you to the most common LDS technology.
The Laser Direct Structuring process, referred to as the LDS process, is a 3D-MID (Three-dimensional molded interconnect device) production technology developed by LPKF of Germany. The principle is that it is a combination of injection molding, laser processing and electroplating. The ordinary plastic components and circuit boards are given electrical interconnection functions, so that the plastic casing and the structural components can be combined with the conductive circuits to form a so-called 3D-MID, in addition to the functions of support and protection, etc., which are suitable for the so-called 3D-MID. IC Substrate, HDIPCB, Lead Frame local fine line production.
To put it simply, on the injection molded plastic support, laser technology is used to directly engrave the three-dimensional circuit pattern on the support, and then electroplating to form the three-dimensional metal circuit, so that the plastic support has certain electrical properties. This technology can be applied to cell phone antennas, automotive electronic circuits, cash dispenser housings and medical grade hearing aids. At present, the most common one is used for mobile phone antennas. Generally, the built-in mobile phone antennas are commonly used. Most of them are fixed on the back cover of the mobile phone by plastic hot melt or directly attached to the back cover of the mobile phone. LDS technology can directly connect the antenna. The laser engraving on the outer casing of the mobile phone not only avoids the metal interference of the internal mobile phone, but also reduces the size of the mobile phone.
The LDS process has a four-step process.1. Injection molding (InjecTIon Molding). This step injection molding a special thermoplastic containing a special chemical additive (so-called laser powder) on an injection molding machine. 2. Laser activation (Laser AcTIvaTIon). This step is activated by the laser beam, which activates the laser powder with a laser to form a metal core and forms a rough surface that provides an anchor point for the next plating. 3. Electroplating (MetallizaTIon). This is a key step in the LDS process. Electroless plating is performed on the surface of the laser-activated plastic to form a 5~8 micron thick metal circuit. The plated metal is copper, nickel, etc., so that the plastic becomes a conductive line. MID component. 4. Assembling. The finished product described above is mounted on the product and sprayed on the circuit as necessary to obtain an excellent appearance.
Advantages of the LDS process1. The proofing cost is low. 2. It is easy to modify during the development process. 3. The plating of plastic components does not affect the characteristics and stability of the antenna. 4. The product volume is further reduced, which is in line with the trend of thin mobile phone development. 5. Increased production. 6, design and development time is short. 7, can be customized according to customer needs. 8, can be used for laser drilling. 9. Compatible with SMT process.
At present, the antenna manufacturer of this technology is vigorously developed internationally.There are Molex, Tyco, Amphenol, Foxconn, Pulse, Kailu, Liard, Liteon Perlos, EMW, etc. Among them, Molex, Tyco and Qiyu have all shipped in large quantities. End users: Nokia, Samsung, SEMC, HTC, RIM, LG, Moto are all organic. This type of antenna is currently mainly used in smart phones, and many people in the industry now believe that such antennas will become the mainstream of future smart phone antennas.
Suspension Composite Insulator Polymer,High-voltage, Low-voltageMaterial,Composite Polymer
TAIZHOU HUADONG INSULATED MATERIAL CO.,LTD , https://www.thim-insulator.com