The new toolkit has been applied in Agent Vi, Dahua, Dell, General Electric's Current, General Electric Medical Group, Hikvision and Honeywell.
The year I took over the Intel IoT department was incredible. Over the past year, I have worked in a team to create a data-driven technology foundation for industrial innovation. The team's strategy is to build silicon platforms and workload consolidation at the edge to enable end-to-end distributed computing across vertical markets. The key to success is to coordinate the ecosystem of partners and developers to make the most of it. Our focused efforts have paid off – in 2017, Intel's IoT business grew by 20% and continued to grow strongly in the first quarter of 2018.
We have seen significant growth in the global IoT market, thanks in part to the dramatic increase in visual applications, especially those that use artificial intelligence (AI). These video and video use cases cover almost every segment of the IoT space, including identifying product defects on assembly lines, managing retail inventory, identifying equipment repair needs in remote locations, and ensuring public safety in cities and airports. These use cases make full use of high-resolution cameras and generate a large amount of data that needs to be aggregated and analyzed.
In the face of this expansive data growth, Intel announced the OpenVINOTM (Open Visual Inference & Neural network OpTImizaTIon) toolkit. The OpenVINOTM toolkit will quickly track the development of high-performance computer vision and deep learning on the edge side. This is the latest in a complete line of Intel® vision hardware and software products that focus on accelerating deep learning and transforming visual data into business insights.
Smart and autonomous driving technology starts with visionTo handle high-quality video data, you must be able to quickly analyze the massive data streams near the edge and respond instantly, moving only useful insights to the cloud asynchronously. To process video data efficiently, companies need to find the right solution for every job. Unlike other companies that believe in the concept of “one-in-oneâ€, Intel believes that the market needs a powerful combination of scalable hardware and software solutions to move into the future of intelligent data-driven. This includes widely deployed and available Intel computing products as well as high performance, efficient Intel FPGA and Movidius solutions.
With the addition of the OpenVINOTM toolkit to the Intel® Vision family of products, Intel® offers the only vision solution that can distribute AI solutions from the edge to the network and the cloud across a wide range of products. This allows our customers to distribute visual solutions flexibly and economically, providing actionable business insights.
Intel Vision Products: Mining the full potential of data
Intel's extensive partner ecosystemIntel® Vision Products and OpenVINOTM Toolkits have been used by a wide range of partners worldwide. For example, Dahua* uses it for smart cities and transportation solutions; GE Healthcare* uses it for medical imaging; Hikvision* uses it for industrial and manufacturing safety. Other partner companies include AgentVi*, General Electric's Current*, Dell* and Honeywell*.
In the visual industry, Intel has conducted extensive and in-depth cooperation with many leading domestic companies. Dr. Pu Shiliang, Senior Vice President of Hikvision, said, "Hikvision is collaborating with Intel to support end-to-end AI/DL solutions from front-end Intel® MovidiusTM cameras to back-end servers. Intel® Movidius The prospects for TM MyriadTM X are exciting. We are also working with Intel on its newly released OpenVINOTM toolkit to improve performance and shorten development cycles. Hikvision looks forward to building a strong and lasting relationship with Intel. Thus achieving technological leadership in the field of AI/DL-based solutions."
Customers can also combine OpenVINOTM toolkits with devices running AWS GreenGrass for deep learning on the edge.
Through deep collaboration with these industry leaders, we have made it clear that Intel is helping the future of intelligence and change.
Technical detailsThe new OpenVINOTM toolkit combines advanced silicon to provide a complete, high-performance solution for edge-to-cloud deep learning and video analysis. Through a variety of common software frameworks such as TensorFlow*, MXNet*, Caffe*, etc., Intel's vision products enable developers to more easily deploy deep learning and machine vision solutions.
The combination of Intel Vision products and the OpenVINOTM toolkit gives developers the flexibility and choice of performance and power to adapt to a wide range of IoT infrastructures.
Intel CPUs with integrated graphics are universally available, giving developers access to a wide range of systems that are consistent with existing architectures and products.
Intel FPGAs provide raw throughput and programming flexibility to quickly adapt to new networks and applications.
The Intel Movidius VPU brings cost efficiency and energy efficiency to a restricted environment while providing the performance needed for a wide range of applications.
As Intel's comprehensive visual strategy expands from the camera to the cloud, video technology penetration across all industries will increase faster. Through in-depth cooperation with companies, we have made it clear that Intel no longer sells parts, but provides easy-to-use visual solutions.
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What does our product include?
1 | JST wire harness |
FH-----0.5mm ZH-----1.5mm | |
SH-----1.0mm PH-----2.0mm | |
GH-----1.25mm VH-----3.96mm | |
EH/XH-----2.5/2.54mm | |
2 | Molex wire harness |
PicoBlade-----1.25mm PicoClasp-----1.0mm | |
PiciLock------1.0/1.5mm Minifit Jr-----4.2mm | |
MicoBlade-----2.0mm MicoClasp-----2.0mm | |
MicoLock-----1.25/2.0mm | |
3 | IDC flat ribbon cable |
Contact material----Copper alloy | |
Test voltage------500V AC | |
Current rating-----1A | |
Cable Technical Data: | |
Contact Material----Tin plated copper | |
Isolationswiderstand-->1000MΩ | |
Insulation Resistance-->1000MΩ | |
Temperature range----- -40℃.....105℃ | |
UL Typ---------UL2651,28AWG |
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